Solder stop masks
We make use of solder stop masks to prevent the formation of solder bridges, isolating soldered areas from other areas of the substrate and improving the soldering process. Its use greatly improves process flow.
| The technique is applicable on a range of surfaces with different types of solder masks. | ||
| specs | default | NOAREL II |
| Temperature resistance | ≤ 288 °C / 10 sec. | |
| Width | at least 0.3 mm ±0.15mm | |
| Position tolerance | ±0.15mm | |
| colour | Green, matte | Black, matte |
Surface Perfection
Global BA GmbH offers three types of surface roughness for substrates: Standard (no treatment), chemical or mechanical treatment.
Other surface grades on request
| Nickel (1) | 2 – 8 µm (8% ± 2% P) |
| Nickel-Gold (1) | Ni: 2 – 8 µm (8% ± 2% P) Au: 0.01 – 0.08 µm |
| Silver (1) | Ag: 0.1 – 0.6 µm Typ. Shear strength: 15 N/mm2 |
| Organic Surface Protection (OSP) Temperature-humidity-test | 85°C / 85% RH@ 24h without oxidation |
| Nickel (1) | 2 – 8 µm (8% ± 2% P) |
| Nickel-Gold (1) | Ni: 2 – 8 µm (8% ± 2% P) Au: 0.01 – 0.08 µm |
| Silver (1) | Ag: 0.1 – 0.6 µm Typ. Shear strength: 15 N/mm2 |
| Organic Surface Protection (OSP) Temperature-humidity-test | 85°C / 85% RH@ 24h without oxidation |
Data matrix code (DMC)
Global BA GmbH offers a Data Matrix Code on various surfaces for all kinds of ceramic substrates. The data content can be either text or numeric.
| Processed area | 2.3 mm x 2.3 mm or 3 mm x 3 mm |
| Aperture size | 0.164 mm x 0.164 mm |
| Position tolerance | ± 0.1 mm |
| Machined substrates | ||
| Laser-drilled ceramic holes | Min. hole diameter: 0,5mm ± 0.05 mm | |
Laser-scribed ceramic (pulsed)
PSL Victory cut (kerf)
Wafer-cut / polished / lapped
Flying-leads (integrated terminals)
Flying-leads (integrated terminals)
